Using Calibre for High Density Advanced Packaging (HDAP) Verification - Part 2
Overview
As a Calibre verification engineer, or a semiconductor packaging engineer concerned about package verification, would you be interested in learning why many of the leading fabless semiconductor companies choose to verify their high density advanced packaging (HDAP) assemblies with Calibre? This two-part webinar series is your chance to find out!
Part one presents an overview of HDAP technologies, including why they’re needed and how they’re being used today. We also introduce the Calibre 3DSTACK tool, and explain how it provides Calibre signoff verification for HDAP assemblies.
In part two, we dive into how to create a virtual package assembly model, and then use that model to drive Calibre verification with the Calibre 3DSTACK tool. We review the key challenges in HDAP verification, and demonstrate how to address them using the Xpedition Substrate Integrator (xSI) and Calibre 3DSTACK tools. Using Cadence APD/SiP, Zuken, or other package layout tools? Don’t worry—our flow is designed to work with any package design toolset. After attending, you’ll understand why many fabless design companies are adopting this flow irrespective of the package layout tools they use.
All attendees will be offered a white paper that provides further insight and background.
What You Will Learn
- What is HDAP?
- How to create an HDAP virtual model with the xSI tool
- Typical verification challenges of HDAP designs
- How to verify an HDAP assembly using the Calibre 3DSTACK tool
Who Should Attend
- Semiconductor verification engineers who use Calibre tools today, and are involved with or interested in using Calibre tools for advanced IC packaging verification.
- Semiconductor packaging engineers or designers who are involved with or interested in advanced IC packaging verification challenges, and want to learn how the Calibre 3DSTACK tool can help resolve them.
Products Covered
- IC Packaging
Details
What
Live webinar: Using Calibre for High Density Advanced Packaging (HDAP) Verification -
Part 2
When
Wednesday the 26th of August 2020
Where
Online
Time
3:00 PM - 4:00 PM CEST
As a Calibre verification engineer, or a semiconductor packaging engineer concerned about package verification, would you be interested in learning why many of the leading fabless semiconductor companies choose to verify their high density advanced packaging (HDAP) assemblies with Calibre? This two-part webinar series is your chance to find out!
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