03 April 2018


Why Do Temperature-Based FEA?

Unless you’re in a perfectly controlled, relatively benign environment, there will be thermomechanical stresses impacting your product. This can occur while driving your car or sending a submarine to explore the Mariana Trench or launching a spacecraft to circle the sun. The combination of thermal and vibration loading conditions significantly impacts the lifetime of the components in your printed circuit card assembly (PCBA). Understanding the responses of your PCBAs under these environmental stressors is key to answering that ultimate question, “When will my board fail?”


With the release of Sherlock v.5.4, the industry can assess the effects of temperature-dependent vibrational and shock events on the fatigue life of PCBAs. Most importantly, the analyses now incorporate temperature-dependent material mechanical properties existing throughout the assembly. One can quickly and easily model their designs and run a temperature-based simulation to discern more accurate fatigue predictions based on real-life, extreme environments.




Technical Webinar: Why Do Temperature-Based FEA?



Thursday the 19th of April






11 am EST or 2 pm EST