BGA Routing: When Less is More!

02 October 2008

BGA Routing: When Less is More!


Presented by: Charles Pfeil, Engineering Director


Take our CliffNotes approach to learning!
Short on time? Take our CliffNotes™ approach to the best routing techniques for today's high-pin-count BGAs!

Charles Pfeil has condensed the most important aspects of his 188-page book, BGA Breakouts and Routing : Effective Design for Very Large BGAs, into a 30-minute webcast.

That's right, you can learn the principles for successful BGA routing in just 30 minutes! Even if you can read 500 words per minute, Charles' webcast will be hard to beat.

Why designers care about BGA routing
Good designers pride themselves on limiting PCB layers. That's smart because layers affect both fabrication costs and product reliability.

But these same designers struggle when routing the high-pin-count ball grid arrays (BGAs) that are becoming increasingly popular with electronics manufacturers. The reason is simple. A high-pin-count BGA, when routed to its PCB, is the single greatest contributor to high layer counts.

Without a breakout strategy for getting traces out of the BGA, the layer count will be excessive, causing cost and reliability to suffer. Knowing how to create an effective fanout pattern can save space and minimize layer count.


What the presentation is about
Charles' presentation is the best, quickest way to learn the principles behind effective BGA fanouts. In it, he'll show you how designers create unique and effective fanout patterns for:

  • Through-hole vias
  • Blind & buried vias
  • HDI micro-vias

The presentation also explores a variety of theoretical approaches, exposes their inadequacies, considers the impact of different via models, and provides via patterns that work in each context.

Quickly learn the principles behind effective BGA fanouts: view now!