13 September 2023

 

We are happy to anounce the new releases in the electronic system design products of Siemens. The new release is the VX.2.14 release and accounts for the product lines Xpedition, Xpedition IC Packaging, HyperLynx and PADS Professional. This release delivers differentiated technologies while continuing EBS’ continued investment in release quality.

 

Xpedition VX.2.14
The new release for Xpedition brings improvements to EDM integration, design reuse, routing automation, integrated verification, and documentation accessibility.
 
Featured Content: 
What’s New video Xpedition VX.2.14 on the Siemens website 

 

Download the release here
 
 
Xpedition IC Packaging VX.2.14
For IC Packaging the release delivers capabilities targeting heterogeneous integration and the prototyping, planning, design, and verification of next-generation 2.5/3D package assemblies. 
 
Featured Content:
What’s New video IC Packaging VX.2.14 on the Siemens website 

 

Download the release here
 
 
HyperLynx VX.2.14
The new release for Hyperlynx includes significant improvements for DDR5 interface design & verification, standards-based serial link design & verification, as well as improved integration with Engineering Data Management, or EDM.
 
Featured Content:
What’s New video Hyperlynx VX.2.14  on the Siemens website 

 

Download the release here
 

PADS Professional VX.2.14
This new release for PADS Professional delivers new functionality to the cloud apps, plus enhancements to PADS Designer and Layout to improve product usability, performance and efficiency.
 
Featured Content:
What’s New video PADS Prof VX.2.14 on the Siemens website 

 

Download the release here
 
 
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