How to handle underfill in Sherlock?
Underfill materials are actively used to fortify PCB designs so that these products can fulfil a plethora of applications and industry standards. From NASA’s space probe, Juno, to autonomous vehicles, underfill materials are present everywhere. While underfilling is a decades long technique, the materials implemented are continuously evolving in response to the growing needs of the electronics industry. New materials require extensive time and resources to fully characterize the mechanical properties and its influence on key components on an assembly.
To alleviate the need for some testing, simulation is used as a complimentary effort to qualify material changes. Sherlock distinguishes itself as the only simulation tool used in the electronics industry to predict the success of underfill materials. During this webinar you will learn how Sherlock uses a combination of FEA and Reliability Physics to quantify the life of a product stressed by its field and test environments.
Details
What
How to handle underfill in Sherlock?
When
Thursday the 6th of December 2018
Where
Online
Register
In this Webinar you will even learn about some automated ways to create multiple sheets with notes, stack-ups and drill data. You will also be taught how to add PCB Boards and update changing data during the design and manufacturing process.
How to Unearth Deep Bugs Faster and Cheaper Using Formal Bug Hunting TechniquesUsing formal to fully verify blocks using an “assurance” based methodology to prove properties about a design can take a team with a very specific skill set.