
Wearable Electronics Reliability Issues and Real Life Solutions in Printed Electronics
We are fascinated by new technology. The wearable electronics market is no different. We are enamored by the futuristic outfits in Tron to the latest high tech fashion-Google glass.
But what are the real life requirements of a typical wearable electronics device? It must be non-restrictive, portable, accessible, controllable, and have both localized communication and/or wireless communications capabilities. The device needs to be able to withstand a variety of environmental, physical and usage conditions.
Does the commercial industry for wearables design for these conditions? How does this affect the consumer experience? Understanding the issues that impact wearable electronics reliability is critical to market acceptance and consumer satisfaction. During this webinar DfR Solutions will review these reliability issues and the Engineered Materials Systems division of Nagase America will provide insight into solutions for printed electronics applications.
Engineered Materials Systems has developed durable and stretchable electrically conductive inks available for the Wearable Technology and Smart Fabrics market. During this webinar, EMS will present data that shows stretch performance as developed both in-house and third party, along with existing and under development commercial applications. Compatible and enabling substrate options will be identified along with printing methods and a road map of future development needs. Wearable Technology represents unprecedented potential for Printed Electronics with numerous valued end-user applications.
Details
What
Wearable Electronics Reliability Issues and Real Life Solutions in Printed Electronics
Presenters
Greg Caswell of DfR Solutions and Joshua Chirieac-Marinescu of EMS/Nagase America
When
Thursday the 30th of July
- 5:00 PM - 6:30 PM CEST
- 8:00 PM - 9:30 PM CEST
Where
Online
In this webinar DfR Solutions will present the issues and a methodology for defining the requirements for your application to address ESD at the component, circuit board and system levels.
PADS World TourPADSĀ® World Tour introducing the new PADS solutions built to overcome the challenges engineers need to address in their design environments.